High Heat-Flux DesignImprove chip-side heat removal efficiency
AI INFRASTRUCTURE LIQUID COOLING
AI Liquid Cooling Thermal Modules
From Components to System Solutions
Focused on key AI liquid-cooling technologies, we integrate heat exchangers, valves, stainless-steel cast components, compression fittings, manifolds, leak detection, and validation. Through project-based services, we help customers move from component sourcing to system-level integration and build a dedicated Tier 1.5 supply chain.
Reliability ValidationQuality control from materials through the complete system
Custom System IntegrationRapid adaptation to customer application requirements
Mass-Production SupportBalance quality, cost, and delivery
ManifoldLiquid Cooling Manifold
Heat ExchangerHeat Exchanger
ValvesValves
Compression FittingsCompression Fittings
Stainless CastingsStainless-Steel Castings
System SolutionFrom Components to System Solutions
Project ServiceProject Services & Integration
ValidationPerformance & Reliability Validation
Heat ExchangerValvesStainless-Steel CastingsCompression FittingsManifolds & Validation
ABOUT SLC SOLUTIONS
Focused on AI Infrastructure
Liquid Cooling Integration Partner
A Tier 1.5 thermal-module supplier for AI infrastructure liquid cooling, focused on thermal management and liquid-cooling integration to deliver efficient, reliable, production-ready solutions.
Bao Shun Xin Enterprise Co., Ltd. operates the SLC Solutions brand for professional AI liquid-cooling services, combining component supply, module design, system integration, validation testing, and production ramp-up to shorten development cycles and reduce integration risk.
Components & Module Supply
System Architecture & Engineering Integration
Testing, Validation & Production Ramp
Project Services
COMPANY OVERVIEW
Company Overview
Founded
1998Headquarters
Taichung Industrial ParkAnnual Revenue
TWD 470 MillionFactory Area
Approx. 2,400 pingVISION
Vision
To become the preferred Tier 1.5 thermal-module partner for thermal management and liquid-cooling system integration, enabling greener, more energy-efficient AI servers and high-performance computing worldwide.
ORGANIZATION CHART
Organization Chart
PRODUCT MODULES
Core Product Modules
Modular Design · Flexible Integration · High Reliability
01
Heat Exchanger
- Plate, gasketed, and multiple heat-exchanger configurations
- High-efficiency heat transfer and stable temperature control
- Customizable for flow, temperature, and fluid conditions
02
Valves
- Ball, butterfly, and control valve applications
- Manual, pneumatic, and electric actuation options
- Selectable by pressure class and connection specification
03
Stainless-Steel Cast Components
- Wide range of precision stainless-steel components
- For valves, modules, and equipment structural integration
- Custom dimensions, tolerances, and surface finishes
04
Compression Fittings
- Fast installation and maintenance for liquid-cooling piping
- Reliable sealing and pressure performance
- Multiple sizes, connection styles, and material options
05
Manifold
- Multi-branch fluid distribution and return integration
- For data-center and liquid-cooling system layouts
- Customizable by connection, branch count, and flow requirements
INDUSTRIAL FLOW & HEAT TRANSFER
Product Showcase
PRODUCT GALLERY1PC Ball Valves
6 Products
Actual product materials, dimensions, pressure ratings, connections, heat-transfer capacity, and supply specifications are subject to project selection and formal quotation.
SYSTEM CAPABILITY
System-Level Capabilities
Thermal & CFD Design
Architecture assessment and optimization based on heat load, flow rate, and pressure drop.
Materials & Reliability Validation
Evaluate coolant compatibility, sealing, pressure resistance, and long-term operation.
Monitoring & Control Integration
Integrate temperature, pressure, flow, leak alarms, and control logic.
End-to-End System Integration
Connect chip, rack, facility, and control-side interfaces end to end.
LIQUID COOLING ARCHITECTURE
Four-Layer Integration Architecture
Application-driven integration of chip cooling, rack liquid loops, facility cooling sources, and intelligent controls into a scalable liquid-cooling system.
Discuss System ArchitectureCHIP LEVEL
Chip Cooling Layer
Cold plates, thermal interfaces, quick connects, and chip-side flow channels.
RACK LEVEL
Rack Liquid Loop Layer
CDU, manifolds, hoses, and rack distribution.
FACILITY LEVEL
Infrastructure Layer
Heat exchangers, pumps, cooling equipment, and piping.
CONTROL LEVEL
Control & Monitoring Layer
Sensors, alarms, controllers, and data interfaces.
APPLICATIONS
AI Data Center Applications
Liquid-cooling architecture planned around equipment density, site conditions, and O&M requirements.
ENGINEERING SERVICE
Project Services & Validation
A traceable project workflow from requirement analysis and solution design through mass-production supply.
Requirement Analysis
Confirm heat load, flow, temperature, pressure, space, and connection conditions.
Solution Design
Plan cold plates, CDU, manifolds, piping, and control architecture.
Prototype Fabrication
Prototype fabrication, assembly, and functional verification.
System Validation
Performance, sealing, pressure, and reliability testing.
Production Ramp-Up
DFM, process planning, quality standards, and supply-chain readiness.
Mass-Production Supply
Production, inspection, delivery, and technical support according to project schedule.
TIER 1.5 PARTNERSHIP
Build a Dedicated Liquid-Cooling Supply-Chain Partnership
Flexible engagement models aligned with customer R&D schedules and procurement strategies, from individual components and module integration to complete system projects.
Component Supply
Supply of heat exchangers, valves, stainless-steel cast components, compression fittings, manifolds, and related modules.
Solution Integration
Integrate components and system interfaces to specification for rapid deployment.
Project Services
Project execution covering design, validation, mass production, and continuous improvement.
Joint Development
Co-develop products and systems with customers to build a long-term collaboration platform.
CONTACT US
Work With Us
Accelerate AI Liquid-Cooling Innovation
Send us your heat load, flow rate, temperature, pressure, connection, space, and estimated quantity requirements, and we will provide an initial assessment.
Bao Shun Xin Enterprise Co., Ltd.
SLC Solutions
Business Division | Thermal / AI Liquid Cooling
- Tel
- 04-23508688
- Fax
- 04-23508658
- LINE
- LINE ID：sean09751025
LINE CONTACT
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LINE ID：sean09751025
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